Loading Conceptually similar View more with similar tones Document Date: May 31, 2021 An outside view of the new Bosch 300-millimetre wafer fab for silicon chips in Dresden, Germany, May 31, 2021. REUTERS/Matthias Rietschel Select usage Category System ID: RTXCSS23 IMAGE ID RC2ZQN9OC5M6 Size: 5500px × 3473px File Size: 5.22 MB Photographer: Matthias RietschelCountry: Germany City: Dresden Tags: ECO SCI Related Images: View MoreAdd to lightboxAdd to cartBuy/download